Eastek International provides support for all steps in the DFM and manufacturing process, including engineering, printed circuit board fabrication and assembly, and logistical support. Eastek is flexible and responsive and has been providing global resources paired with local U.S. support for 30 years.
Eastek can provide lower-cost solutions while simultaneously maintaining clear, open client communication on solutions that preserve product quality. We have world-class facilities located in China, Malaysia, and Mexico with our corporate headquarters located outside of Chicago, IL. Warehousing & logistics, engineering management, sales, and customer service all based at our corporate headquarters.
Our PCBA manufacturing process is a key element of our industry-leading, fully customizable manufacturing solution. We offer a complete catalog of PCBA manufacturing solutions including design, prototyping, sourcing, production, and logistics, all combined with the benefits of low-cost country presence and support in your language and time zone.
Easteks production services are flexible enough to handle low-to-high volume requirements or high and low-mix products with efficiency. From DFM through assembly and test, quality is a top priority. Assembly and inspection follow the IPC-A-610 requirements for either leaded or RoHS compliant production.
Headquartered in the northwestern suburbs of Chicago, Eastek is a vertically integrated contract manufacturer founded in 1990. We opened a manufacturing facility in the same year. In early 2020, we opened a manufacturing facility in Malaysia and recently opened a new facility in Mexico in early 2021. This gives our customers a choice when manufacturing.
Eastek assembles printed circuit boards according to IPC610E Class II standards,?lean manufacturing methodology, and?total quality measurement standards.
Separate manufacturing lines are dedicated to RoHS compliant and non-RoHS assembly processes. PCBA is part of the fully customizable Eastek Single Source Solution.
- Surface Mount Line (SMT placement to 0201)
- BGA (Up to 508 x 457 mm)
- Through-hole (manual and automated)
- Burn-in capabilities, thermal and life cycle
- Conformal coating (manual and automated)
- Ionization level testing
- Radio Frequency (RF), In-Circuit Testing (ICT), Functional, & ATE Testing
- Aqueous PCBA cleaning
- FDA QSR compliant process validation and DHRs with full component traceability